Samsung has officially confirmed that the Exynos 2700 chipset is in development, giving us our first direct confirmation that the company’s next flagship processor is on the way.
Samsung usually launches its Galaxy S flagship phones with two different chip options. Some markets get Qualcomm’s latest Snapdragon processor, while others receive Samsung’s own Exynos chip. There have been a few exceptions in recent years. Both the Galaxy S23 series in 2023 and the Galaxy S25 series in 2025 launched exclusively with Snapdragon processors, leading many to wonder if the Galaxy S27 could receive the same treatment.
That now seems unlikely. During a recent management briefing (via Hankyung), Samsung System LSI President Park Yong-In confirmed that the Exynos 2700 is currently being developed. According to Hankyung, Park said development is progressing without setbacks and that the chip is being prepared for use in “top-tier smartphones.” While Samsung did not name any devices, the Galaxy S27 series is widely expected to be the first lineup to use the new processor.
Leaks suggest major efficiency improvements
Reports about the Exynos 2700 have been circulating since 2024. One early leak claimed Samsung was targeting a 12% performance improvement over the previous generation. More notably, the company was reportedly aiming to reduce power consumption by 25% while also making the chip 8% smaller.
Previous reports have also suggested that the Exynos 2700 will be built on Samsung Foundry’s second-generation 2nm manufacturing process, known as SF2P. Samsung is also said to be working on new thermal management technologies to improve efficiency and maintain performance under load.
Early benchmark results paint an interesting picture
In April, a Geekbench listing believed to belong to an Exynos 2700 engineering sample appeared online. The chip delivered scores that were roughly in line with the current Exynos 2600. What stood out was that the sample achieved those results while running at clock speeds below 3GHz.
That could indicate Samsung is focusing on improving efficiency rather than simply pushing for higher benchmark scores. There have also been reports suggesting that the South Korean giant could be implementing a new Heat Path Block (HPB) design for the Exynos 2700, which could improve cooling. Qualcomm’s next Snapdragon flagship chip, likely called the Snapdragon 8 Elite Gen 6 Pro, is expected to maintain higher peak performance, but Samsung may prioritize better battery life and more consistent performance over longer periods of use.
